company news about How clean does electronic chip manufacturing require?

In the electronic chip manufacturing process, the requirements for cleanliness in different production areas are different, mainly based on the ISO 14644-1 standard and the precision needs of the production process to determine. Here are the specific requirements:

1. Wafer manufacturing area

Lithographic area: The highest cleanliness requirements, usually ISO 1-3, need to control 0.1 micron and above particles. This is because in the photolithography process, tiny particles may cause defects in the photolithography pattern, affecting the chip performance.
Etching and deposition areas: high cleanliness requirements, generally ISO 3-5, need to control 0.3 micron and above particles.

2. Package the test area

Package area: Medium cleanliness requirements, usually ISO 5-7, need to control 0.5 micron and above particles.
Test area: Cleanliness requirements are low, generally ISO 7-8, need to control 0.5 micron and above particles.

3. Auxiliary area

Chemical storage area: Cleanliness requirements are low, usually ISO 7-8.
Equipment maintenance area: minimum cleanliness requirements, generally ISO 8 level.

4. Personnel and material access area

Dressing rooms and air showers: Cleanliness requirements are medium, usually ISO 5-7.
Material access area: cleanliness requirements are low, generally ISO 7-8 level.
Cleanliness maintenance measures
Air purification system: Equipped with high efficiency filter (HEPA) and ultra-high efficiency filter (ULPA) to ensure air cleanliness.
Airflow organization: Vertical unidirectional flow is usually used in the lithography region, and non-unidirectional flow can be used in other regions.
Temperature and humidity control: The temperature is generally controlled at 22 ° C ±2 ° C, and the humidity is controlled at 45%-65% RH.
Positive pressure control: A positive pressure difference of 5-10Pa should be maintained between the clean area and the unclean area.

In summary, the cleanliness requirements of electronic chip manufacturing vary according to the process and region, the lithography and etching areas have high cleanliness requirements, while the packaging and test areas are relatively low. These stringent cleanliness standards are key to ensuring chip manufacturing quality